Senior III-V IC Design Engineer


A well funded high tech start up in Belgium which focuses on RF Semiconductor ICs for Wireless Communication for 5G infrastructure and automotive markets is looking for a Senior III-V IC Design Engineer to join their growing team in Leuven.

Senior III-V IC Design Engineer, you are responsible for the development of innovative, leading-edge GaN and GaAs-based RF/Microwave/mmWave products for 5G infrastructure and automotive products.

Your responsibilities will include the following:

  • Lead projects (e.g., FEM development) involving multiple design engineers.
  • Guide product development through critical stages including concept/feasibility, development, preproduction, qualification, and production.
  • Manage the overall IC design in all its aspects: from specifications till tape-out, being involved in bringing-up, tuning, and supporting full characterisation.
  • Provide design support for the test board and customer evaluation board design.
  • Depending on experience level, you can be involved in mentoring other team members
As the successful Senior III-V IC Design Engineer you have the following qualifications and skills:
  • PhD or master's degree in Electronic, Electrical Engineering or similar and 10+ years of experience in IC design in III-V based technologies for RF applications
  • Design expertise: Microwave/Millimeter-wave power amplifier, power transistor, driver amplifier, switch, low noise amplifier, phase shifter, or attenuator MMICs and/or hybrid-based components and multi-chip transmit/receive modules
  • Specific experience in advanced compound semiconductor technology such as GaN and/or GaAs required
  • Expert knowledge in SOI switch design is a great plus
  • Expert understanding of FET behavioral characteristics: small and large signal behaviour, breakdown and reliability behavior
  • Proficient at using microwave and EM simulation tools such as Keysight ADS and EM-tools like Keysight RF Pro
Great understanding of:
  • microwave measurements and calibration methods: S-parameters, power, efficiency, source/load pull, noise figure, linearity and intermodulation distortion
  • front-end module design, thermal challenges and simulation setup optimisation's
  • requirements for automotive and infrastructure qualification
  • Knowledge of 3GPP standards, carrier specifications and the ability to translate system requirements into circuit requirements in collaboration with system engineers
For more information about the role and company, contact Ane @ IC Resources with your CV for an initial conversation

Sinds 24/6/2022

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